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1.1 Patch line

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1.2

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The patch is only the beginning of the process, because a lot of assembly work still needs to be done manually, such as the welding of special-shaped components.

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1.3

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After the patch is completed, the next step will be reflow welding, that is, the melting of electronic components on the PV plate.After reflow welding, PV plates that have passed AOI optical inspection can go to the next step: back welding.

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1.4

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The PV plate after reflow welding is not sent to the back welding line, but through AOI optical detection, to see whether there are leakage, misalignment, false welding and other phenomena.

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2.1

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The main processes of the back weld line are welding, burning, testing and screwing.After the completion of the SIM placement process, the PV plate shall be dismantled and trimmed at the first step of the post-welding line.

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2.2

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After welding each functional module, then these modules need to be burned and first tested."Burning" can be simply understood as copying the system software to the functional module.

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2.3

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After burning the board, each function will be manually carried out a preliminary inspection, testing items including star search, signal emission, and whether the function can be applied.

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2.4

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After passing the test, the motherboard will be labeled with a bar code to facilitate later calls and inquiries.

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3.1

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All components that are welded and burned can be assembled with the shell, but the shell of the product needs to be simply modified before assembly.

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3.2

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Motherboard and screen assembly is carried out separately, because stick screen is very exquisite craft, the requirement is carried out in absolutely dust-free workshop.

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3.3

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Finally, the upper and lower housings of the assembly are docked to complete the assembly, and then the next test is carried out.

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3.4

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The assembled machine does not immediately enter the packaging line, but needs to be tested again, the test of qualified products will be sent to the packaging line.

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4. Packaging line

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Before leaving the factory in batch, the products will also be tested for aging. After all the tests reach the standard, the products will be packaged and shipped.If a problem occurs during production, the product will be returned to the maintenance area for testing.

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